Lighting
Halogen / Dichroic / HPS Lamps / Metal Halide
- Potting or bonding applications
- Ceramic and quartz assembly typical
- Requires low coefficient of thermal expansion
- High thermal conductivity preferred
1. What degree of temperature is required?
2. What substrates are being bonded?
3. What electrical properties are required?
4. What thermal expansion properties are required?
5. Please describe application and send photo.
Product Number | Max Service temperature | Coefficient of Thermal Expension | Dielectric Strength | Volume Resistivity | Thermal Conductivity | |||||||
(°F) | (°C) | (°F) | (°C) | (@70°F volts/mil) (@21°C volts/mil) |
(@70°F ohm-cm) (@21°C ohm-cm) |
(Btu. In/ft2hr. °F) | (Watt/m K) | (kiloCalorie/hr/meter °C) | ||||
1 | 1801 | 982 | 6.20E-06 | 1.12E-05 | 12.5 – 51 | 108 – 109 |
11.5 | 7.6 | 1.66 | 1.10 | 1.43 | 0.94 |
P-1 | 1800 | 982 | 6.20E-06 | 1.12E-05 | 12.5 – 51 | 108 – 109 |
10.5 | 7 | 1.51 | 1.01 | 1.30 | 0.87 |
2 | 3000 | 1649 | 7.60E-06 | 1.37E-05 | 48 – 55 | 108 – 1010 |
23.3 | 12.6 | 3.36 | 1.82 | 2.89 | 1.56 |
3 | 2200 | 1204 | 3.40E-06 | 6.12E-06 | 50 – 100 | 106 – 108 |
23 | 13 | 3.32 | 1.87 | 2.85 | 1.61 |
6 | 2500 | 1370 | 6.50E-06 | 1.17E-05 | 12.5 – 51 | 107 – 108 |
N/A | N/A | N/A | N/A | N/A | N/A |
7 | 2500 | 1371 | 6.00E-06 | 1.08E-05 | 12.5 – 51 | 108 – 109 |
N/A | N/A | N/A | N/A | N/A | N/A |
78 | 2600 | 1427 | 3.70E-06 | 6.66E-06 | 12.5 – 51 | 106 – 108 |
6.8 | 7.8 | 0.98 | 1.12 | 0.84 | 0.97 |
P-78 | 2600 | 1427 | 3.70E-06 | 6.66E-06 | 12.5 – 51 | 106 – 108 |
5.4 | 6.2 | 0.78 | 0.89 | 0.67 | 0.77 |